Higher values will result in longer processing time and larger Gerber files. Smoothing amount is a ratio that controls the size of the smoothing chamfers or fillets that are generated when smoothing effort set for the object. Best_Length_Ratio double Best ratio of teardrop length to object size for teardrops connected to the object. Best_Width_Ratio double Best ratio of teardrop width to object size for dimension Maximum width dimension for teardrops connected to the object. Max_Width_Ratio double Maximum allowable ratio of object size to track width for teardrops connected to the object. Footprint Properties

Higher values will result in longer processing time and larger Gerber files. Smoothing amount is a ratio that controls the size of the smoothing chamfers or fillets that are generated when smoothing effort set for the object. Best_Length_Ratio double Best ratio of teardrop length to object size for teardrops connected to the object. Best_Width_Ratio double Best ratio of teardrop width to object size for dimension Maximum width dimension for teardrops connected to the object. Max_Width_Ratio double Maximum allowable ratio of object size to track width for teardrops connected to the object. Footprint Properties

set for the object. Best_Length_Ratio double Best ratio of teardrop length to object size for teardrops connected to the object. Best_Width_Ratio double Best ratio of teardrop width to object size for dimension Maximum width dimension for teardrops connected to the object. Max_Width_Ratio double Maximum allowable ratio of object size to track width for teardrops connected to the object. 封装属性 这些属性适用于封装。 solder paste margin override set for the footprint. Solderpaste_Margin_Ratio_Override dimension The solder paste margin ratio override set for the footprint. Thermal_Relief_Gap dimension The thermal

Higher values will result in longer processing time and larger Gerber files. Smoothing amount is a ratio that controls the size of the smoothing chamfers or fillets that are generated when smoothing effort solder paste margin override set for the footprint. Solderpaste_Margin_Ratio_Override dimension The solder paste margin ratio override set for the footprint. Thermal_Relief_Gap dimension The thermal output", "Open collector", "Open emitter", or "Unconnected". Round_Radius_Ratio double For rounded rectangle pads, the ratio of radius to rectangle size. Shape string One of "Circle", "Rectangle", "Oval"

Higher values will result in longer processing time and larger Gerber files. Smoothing amount is a ratio that controls the size of the smoothing chamfers or fillets that are generated when smoothing effort solder paste margin override set for the footprint. Solderpaste_Margin_Ratio_Override dimension The solder paste margin ratio override set for the footprint. Thermal_Relief_Gap dimension The thermal output", "Open collector", "Open emitter", or "Unconnected". Round_Radius_Ratio double For rounded rectangle pads, the ratio of radius to rectangle size. Shape string One of "Circle", "Rectangle", "Oval"

solder paste margin override set for the footprint. Solderpaste_Margin_Ratio_Override dimension The solder paste margin ratio override set for the footprint. Thermal_Relief_Gap dimension The thermal output", "Open collector", "Open emitter", or "Unconnected". Round_Radius_Ratio double For rounded rectangle pads, the ratio of radius to rectangle size. Shape string One of "Circle", "Rectangle", "Oval" dimension The solder paste margin override set for the pad. Solderpaste_Margin_Ratio_Override dimension The solder paste margin ratio override set for the pad. Thermal_Relief_Gap dimension The thermal relief

and label tools. Overbar offset ratio controls the vertical spacing between text and an overbar ( ~{} ) over that text, as a ratio of the text height. Label offset ratio controls the vertical spacing between size. This also affects the spacing between symbol pins and their pin number. Global label margin ratio defines the size of the box around a global label, relative to the global label’s text size. Increasing exported as a PNG file using the command File → Export Current Plot as PNG… . The size and aspect-ratio of the saved image will match that of the displayed plot in the Simulator. Exporting the simulator

and label tools. Overbar offset ratio controls the vertical spacing between text and an overbar ( ~{} ) over that text, as a ratio of the text height. Label offset ratio controls the vertical spacing between size. This also affects the spacing between symbol pins and their pin number. Global label margin ratio defines the size of the box around a global label, relative to the global label’s text size. Increasing exported as a PNG file using the command File → Export Current Plot as PNG… . The size and aspect-ratio of the saved image will match that of the displayed plot in the Simulator. Exporting the simulator

values will result in longer processing time and larger Gerber files. 26 Smoothing amount is a ratio that controls the size of the smoothing chamfers or fillets that are generated when smoothing effort Reference string 封装的位号。 Solderpaste_Margin_Override dimension 为封装设置的焊膏边缘覆盖。 Solderpaste_Margin_Ratio_Override dimension 为封装设置的焊膏余量比率覆盖。 Thermal_Relief_Gap dimension 为封转设置的散热间隙。 Thermal_Relief_Width "输 入"、"输出"、"双向"、"三态"、"无源"、"自由"、"未指 定"、 "电源输入"、"电源输出"、"集电极开路"、"发射 器开路" 或 "未连接" 之一。 Round_Radius_Ratio double 对于圆形矩形焊盘，为半径与矩形大小的比率。 Shape string "圆形"、"矩形"、"椭圆形"、"梯形"、"圆角矩形"、"倒 角矩形" 或 "自定义" 之一。 Size_X

and label tools. Overbar offset ratio controls the vertical spacing between text and an overbar ( ~{} ) over that text, as a ratio of the text height. Label offset ratio controls the vertical spacing between size. This also affects the spacing between symbol pins and their pin number. Global label margin ratio defines the size of the box around a global label, relative to the global label’s text size. Increasing exported as a PNG file using the command File → Export Current Plot as PNG… . The size and aspect-ratio of the saved image will match that of the displayed plot in the Simulator. 151 Exporting the simulator